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This document was generated on 11/11/2013
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Part Number:
Status:
Description:
Active
0.60mm Pitch miniDIMM DDR Socket, Surface Mount, 22.5° Angle, 0.76μm Gold (Au)
Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits, 2.5V Voltage Key,
Lead-Free
Documents:
Series
image - Reference only
Agency Certification
CSA
UL
LR19980
E29179
ELV and RoHS
Compliant
General
Product Family
Series
Comments
Component Type
Electrical Model
JEDEC Outline
Product Name
UPC
Physical
Circuits (Loaded)
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Net Weight
PCB Locator
PCB Retention
Packaging Type
Pitch - Mating Interface
Plating min - Mating
Plating min - Termination
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Memory Module Sockets
<LI>Latches in Off-White Color
Socket
Yes
MO-258
MiniDIMM
822350075121
200
Black
25
22.5° Angle
94V-0
Yes
Copper Alloy
Gold
Tin
High Temperature Thermoplastic
5.891/g
Yes
Yes
Tray
0.60mm
0.762μm
2.540μm
-55°C to +85°C
Surface Mount
1A
30V
2.5V
5
Reflow Capable (SMT only)
2
260
Not Reviewed
Not Reviewed
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environmental compliance?
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
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87783Series
Mates With
JEDEC MO-258 Modules
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相关代理商/技术参数
0877830301
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0877871011
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0877871012
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制造商:TE Connectivity 功能描述:087791-000
0877910114
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